New High Reliability TSX Fixed Chip Attenuator series for
New High Reliability TSX Fixed Chip Attenuator series for,MixComm SUMMIT2629: 5G 28 GHz Beamforming Front End IC,Stacked Zipper Fin Heat Sink Soldered Onto Aluminum Base,Piezoelectric Ring Chips and Stacks, 2.6 µm to 15.0 µm Travel,Deep subwavelength fourfold rotationally symmetric split,